New 100°C hotmelt adhesive for packaging
With an application temperatu
re of 100°C, Technomelt Supra 100 Cool from Henkel is believed to be the new record-holder among hotmelt adhesives used in the packaging industry. Combined with the benefits of the Supra product range, this innovation delivers higher efficiency in packaging production while also promoting sustainability in customer operations.
The ongoing drive toward high bond quality, high yield and long-term availability is getting more important in packaging production. In addition to its low application temperature of 100°C and its high adhesive strength, Technomelt Supra 100 Cool is also characterised by its wide-ranging suitability in case sealing, carton closing and tray erection.
Production trials carried out by consumer goods manufacturers throughout Europe have demonstrated that the low application temperature of Technomelt Supra 100 Cool reduces the energy requirement compared to conventional hotmelts by up to 50%. Technomelt Supra 100 Cool is, like all products of the Technomelt Supra line, suitable for application in the food industry.
A further benefit of Technomelt Supra 100 Cool is its good heat resistance and cold flexibility, which enables its use for both warm-filling and deep-freeze applications. Compared to Henkel’s Coolmelt Ultra 90, this new hotmelt reduces adhesive consumption – in the case of a carton sealing, for example – by up to 25%, as was also recently validated in the industry trials.
The low application temperature also means faster applicator start-up. It also enhances one of the decisive advantages of Henkel’s Supra technology: thanks to this innovative hotmelt, the amount of wear and tear to which machine components and applicators are subjected can be appreciably reduced, with the maintenance input involved in removing cracking residues also diminishing. These plus points both improve the equipment and spare part lifetime and increase production efficiency.
